x x e e o o n n p p o o w w e e r r w w a a r r m m w w h h i i t t e e l l e e d d 1 1 w w 7 7 0 0 v v OS5M7NE1E1E ver.1 features outline dimension highest luminous flux super energy efficiency long lifetime operation superior uv resistance applications read lights (car, bus, aircraft) portable (flashlight, bicycle) bollards / security / garden traffic signaling / beacons in door / out door commercial lights automotive ext tolerances are for reference only unit:mm tolerance:0.30mm 3.6 backview absolute maximum rating (ta=25) (ta=25) (ta=25) (ta=25) directivity item symbol value unit dc forward current i f 20 ma pulse forward current* i fp 30 ma reverse voltage v r 80 v power dissipation p d 1520 mw operating temperature topr -30 ~ +85 storage temperature tstg -40~ +100 lead soldering temperature tsol 260 /5sec - *pulse width max.10ms duty ratio max 1/10 0 0 electrical -optical characteristics (ta=25 (ta=25 (ta=25 (ta=25 ) )) ) forward operating current (dc) item symbol condition min. typ. max. unit dc forward voltage v f i f =15ma 66 70 76 v dc reverse current i r v r =25v - - 10 a luminous flux v i f =15ma 90 100 - lm color temperature cct i f =15ma - 3000 - k x i f =15ma - 0.44 - - chromaticity coordinates* y i f =15ma - 0.41 - - 50% power angle 2 1/2 i f =15ma - 140 - deg 400 350 300 250 0 50 100 150 200 0 25 50 75 125 forward current, i f (ma) 100 r j-a =60 /w r j-a =50 /w r j-a =40 /w r j-a =30 /w ambient temperature, t a ( ) note: don?t drive at rated current more than 5s wit hout heat sink for xeon 1 emitter series. led & application technologies
x x e e o o n n p p o o w w e e r r w w a a r r m m w w h h i i t t e e l l e e d d 1 1 w w 7 7 0 0 v v OS5M7NE1E1E ver.1 soldering heat reliability (dip): reflow soldering profile reflow soldering should not be done more than two times. when soldering, do not put stress on the leds dur ing heating. after soldering, do not warp the circuit board. repairing should not be done after the leds have been soldered. when repairing is unavoidable, a double-head soldering iron should be used. it sho uld be confirmed beforehand whether the characteristics of the leds will or will not be damaged by repairing. solder average ramp-up rate = 3oc/sec. max. preheat temperature: 150o~180oc preheat time = 120 sec. max. ramp-down rate = 6oc/sec. max. peak temperature = 220oc max. time within 3oc of actual peak temperature = 25 sec. max. duration above 200oc is 40 sec. max. led & application technologies
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